974 Centre Road
Wilmington, DE 19805
455 Forest Street
Marlborough, MA 01752
INSULECTRO is the distributor for this and other DuPont Electronic Solutions products.
COPPER GLEAM™ ST-901
High current density DC copper plating
COPPER GLEAM™ ST-901 is a revolutionary high throw acid copper plating process for printed circuit boards which provides dramatic improvements in cycle time without the need for specialized equipment or cell modifications.
- Suitable for soluble anodes in vertical continuous plater
- Excellent throwing power in substrates with a high aspect ratio
- Excellent Thermal Shock resistance by means of high elongation and low stress
- Easily controlled by CVS analysis
- Superior plating distribution
- Excellent physical properties
- Complete analytical control
Building conductors on printed circuit boards requires acid copper electrolytes and organic additives tuned to the specific requirements of the board design. DuPont Electronic Solutions provides an extensive range of processes to meet the requirements for panel or pattern plating; flex or rigid; thick or thin panels and for conformal plating or copper filling technology.
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