974 Centre Road
Wilmington, DE 19805
455 Forest Street
Marlborough, MA 01752
INSULECTRO is the distributor for this and other DuPont Electronic Solutions products.
COPPER GLEAM™ CUPULSE
Vertical pulse plate for high aspect ratio
The COPPER GLEAM™ CUPULSE process was designed for copper plating of printed circuit boards using PPR current. This process is especially suited for reducing cycle times on thick-panel, high-aspect ratio designs.
- Versatile PPR plating system
- High aspect ratio and mixed technology capability
- Novel analytical methods ensure the process remains in control and at the optimum set points during operation - the analytical procedures are quick and simple to run
- Unsurpassed performance on thick-panel, high aspect ratio applications
- Stable, consistent plating performance over the lifetime of the bath
- Superior through-hole leveling performance
Utilization of periodic pulse rectification allows for improved throwing power and surface distribution of plated copper versus conventional DC plating. DuPont Electronic Solutions has developed a range of additives to provide optimum results for horizontal and vertical applications.
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